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Valco Melton will occupy booth S-2933 at PACK EXPO 2010
Chicago, IL – October 31- November 3, 2010.

PACK EXPO is the U.S.A 's top event when it comes to innovative packaging solutions. This event is ideal for decision-makers looking for new solutions that save resources and improve efficiency. This year's show focuses on the latest technological developments from leading industry suppliers including exciting and NEW products by Valco Melton. We are excited to have the chance to meet with you to introduce these new items and to show you how they can help your company to maintain a competitive advantage within the industry.

Valco Melton's extensive range in gluing and quality system products and compatible parts continue to win new business and maintain long lasting relationships, thanks to leading technology and an expanded and focused sales and support network. Our expertise in quality monitoring and inspection, cold gluing and hot melt application parts and systems has been the culmination of 55 years of experience. We have been globally recognized as one of the industries most knowledgeable leaders in each of these areas.

We would be pleased to have you visit our PACK EXPO 2010 booth at Chicago's McCormick Place, South Hall S-2933. Come discover a new range of hot melt, cold glue, and quality assurance system equipment, which will without a doubt provide an innovative solution to most any of your gluing requirements.

Visit the following Valco Melton web pages for additional information about our equipment for the Packaging Industry. We hope to see you at PACK EXPO!

Hot melt equipment
Packaging
Cold Glue